Hanoi University of Science and Technology (HUST)

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IEEE ICCE 2024 Wraps Up: New Avenues for Collaborations

IEEE ICCE 2024 Wraps Up: New Avenues for Collaborations
After three dynamic days of work from 31/07 to 02/08, the 10th IEEE International Conference on Communications and Electronics (IEEE ICCE) in Da Nang concluded successfully, fostering collaborations and exchanging cutting-edge research among global researchers, experts, and businesses.

Co-organized biennially by Hanoi University of Science and Technology (HUST), Ho Chi Minh City University of Technology (HCMUT), and University of Science and Technology - The University of Danang (DUT), the conference also attracted interest from several local universities, including University of Technology and Education - The University of Danang, Vietnam-Korea University of Information and Communication Technology, The University of Danang, and VinUniversity.
 
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HUST faculty in IEEE ICCE 2024 Organizing Committee
A Compass for Global Integration

In his opening speech, Assoc. Prof. Huynh Quyet Thang, President of HUST and Honorary Co-Chair of the 10th IEEE ICCE 2024, emphasized that the conference served as a prestigious forum for international academia and contributed to the advancement of industrialization.
 
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Assoc. Prof. Huynh Quyet Thang, President of HUST and Honorary Co-Chair of the 10th IEEE ICCE 2024
“The topics discussed at IEEE ICCE 2024 reflect the university's current and future missions. Learning from the high-quality research presented today will enable HUST to effectively contribute to the country's industrialization and modernization, guiding our path to international integration,” said Assoc. Prof. Huynh Quyet Thang.

The conference also provided diverse insights, encouraging participants to advance in their technological exploration. Suk Jiwon, General Director of Samsung R&D Vietnam (SRV) and a representative of this year’s main sponsors, noted, “The IEEE ICCE conference has become a fantastic platform for discussing and sharing innovative ideas and exploring groundbreaking solutions in the Electronics and Communications industry.” 
 
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Suk Jiwon, General Director of Samsung R&D Vietnam (SRV)
A Leap Forward in QUALITY

This year, the conference was sponsored by the Institute of Electrical and Electronics Engineers (USA), their Vietnam sector, and leading technology companies such as Samsung, ASIC Technologies, Vingroup Innovation Foundation, Tektronix, and VNPT Technology, etc.

The conference tracks covered: Communication Networks and Systems, Signal Processing, Microwave Engineering, Electronic Systems, and Power Electronics. The following keynote presentations by leading scientists showcased their valuable research in these fields:
 
•   “Getting started with 6G – Emerging 6G Toolkits and Testbeds for enabling 6G research and development for all” by Prof. Thomas Magedanz (Technical University of Berlin, Germany): Outlining the current international progress in developing 6G-ready testbeds and the introducing new “OPEN research infrastructures and toolkits for 6G (OpenRIT 6G)” initiative which aimed at fostering idea exchange and building a foundation for 6G for all.

•   “Ultrasound-mediated Neuromodulation” by Dr. Hyunjoo Jenny Lee, (KAIST, South Korea): Introducing new neurotools which are essential to uncovering the fundamental mechanisms of ultrasound brain stimulation and ultimately to developing an effective therapeutic means for brain disorders, particularly degenerative diseases.

•   “Paradigm Shifts in the Design of Human Activity Recognition Systems Using Radar Sensors” by Dr. Matthias Pätzold (University of Agder, Norway): Dealing with human activity recognition using radar sensing techniques, from wave propagation in the presence of human activities to modern time-frequency signal analysis and processing techniques, to machine and deep learning methods.

•   “Overcoming the Technical Hurdles to $1T Revenue in Semiconductor: from Materials to Systems” by Dr. Nguyen Thi Bich Yen (Senior Fellow, SOITEC USA) and Dr. Christophe Maleville (Chief Technology Officer, Senior Executive Vice President of SOITEC Innovations): Presenting a strategic pathway, starting with advancements in novel materials such as high-mobility channel materials, substrate engineering, and 2D semiconductors, highlighting the collaborative efforts required from material scientists, process/integration engineers, device designers, and system designers to realize this unprecedented revenue potential, ultimately aiming towards trillion-dollar revenues.

Notably, a roundtable discussion titled "Emerging Trends in Semiconductor Devices and Systems: A Global and Vietnamese Perspective" was specially organized for local faculty and researchers in the semiconductor field, featuring industry-leading experts as speakers: Dr. Nguyen Thi Bich Yen (Senior Fellow, SOITEC USA), Prof. Le Hanh Phuc (UC San Diego, USA), Mr. Nguyen Phuc Vinh (Senior Director of Engineering of Synopsys Vietnam, Member of the HSIA Executive Committee, Co-founder of Vietnam Semiconductor Community), and  Assoc. Prof. Nguyen Duc Minh (Vice Dean of HUST School of Electrical and Electronic Engineering).
 
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From the left: Assoc. Prof. Nguyen Duc Minh (Vice Dean of HUST SEEE), Mr. Nguyen Phuc Vinh (Senior Director of Engineering at Synopsys Vietnam, Member of the HSIA Executive Committee, Co-founder of Vietnam Semiconductor Community), Prof. Le Hanh Phuc (UC San Diego, USA), and Dr. Nguyen Thi Bich Yen (Senior Fellow, SOITEC USA)
The discussion focused on three main topics:
 
•   Collaborating on research for a product aligned with national strategy, fostering cross-disciplinary teamwork. 
•   Prioritizing training to develop a skilled workforce for advanced packaging technology. 
•   Seizing the increasing global demand for semiconductor talent, while acknowledging the need for long-term investment and effort from faculty and researchers.

A Remarkable Increase in QUANTITY

The IEEE ICCE 2024 received 271 submissions from authors across 31 countries, a 40% increase from the 193 papers submitted at IEEE ICCE 2022.

With a publication acceptance rate of 49% for the IEEE ICCE 2024 proceedings archived in the IEEE Xplore digital library, the organizing committee selected 133 papers, representing over a 60% growth compared to the 83 papers chosen for the 9th conference. The conference also accepted 29 posters.

Additionally, this year's conference featured 40 oral presentation sessions, 3 poster presentation sessions, and awarded 7 "Best Paper" prizes—3 for specialized research areas and 4 for major research themes.

A total of 213 participants attended from 16 countries and territories, with strong representation from Asian countries with developed electronics and communication industries, such as South Korea, Japan, China, and Taiwan.

New Avenues for Potential Partnerships

Assoc. Prof. Nguyen Huu Thanh, Dean of HUST SEEE, highlighted the presentation on integrated circuit design and semiconductors as a key achievement, showcasing new aspects of a field with a "surge" in workforce demand in recent years.
 
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Assoc. Prof. Nguyen Huu Thanh, Dean of HUST SEEE
“The success of IEEE ICCE 2024 has opened new doors for international and domestic collaborations, enabling SEEE to develop a new interdisciplinary program in integrated circuit design to prepare a workforce for key technology trends like artificial intelligence and big data,” said the Dean.

Overall, it can be said that HUST's active and responsible participation as a member of the organizing committee at the IEEE ICCE 2024 has proven the institution's significant role and reputation as a leader in the field.

English edit: Khanh Phuong

Author: HUST School of Electrical and Electronic Engineering

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